MEMS industry is projected to become a $11.5B industry by 2011.
Number of MEMS devices available are increasing and fabrication techniques/materials used are growing rapidly.
Conventional integration strategies are becoming obsolete and are unable to keep up with demand for:
increased compatibility with new materials /processes
higher performance (electrical and mechanical)
higher I/O density
shorter time-to-market
lower cost solutions
My research aims to address above demands through the use of novel compliant interconnects and through-silicon-vias, thereby enabling the integration of a state-of-the-art CMOS process with an arbitrary MEMS process.
Cubicle H3
Microelectronics Research Center
Georgia Institute of Technology
791 Atlantic Dr. NW Atlanta, GA 30332-0269
jyang {at} gatech {dot} edu
(404) 513-6864