Awards

2010 Georgia Tech Research and Innovation Conference (GTRIC) Outstanding Poster Presentation

2009 IMAPS International Symposium on Microelectronics Best Student Paper Award

2009 IMAPS International Symposium on Microelectronics Best in Session Paper Award

2009 SRC TECHCON Best in Session Paper Award

2003-2007 Georgia Tech Dean's List

Journal Papers

[1] J. Lai, H. S. Yang, H. Chen, C. R. King, J. Zaveri, M. S. Bakir, "A mesh seed layer for improved through-silicon via fabrication," Journal of Micromechanics and Microengineering, Feb 2010

Conference Proceedings

[1] J. Zaveri, C. R. King, H. S. Yang, M. Bakir, "Wafer Level Batch Fabrication of Silicon Microchannel Heat Sinks and Electrical Through Silicon Vias," SRC TECHCON, Austin, TX, Sept. 2009.

[2] C. R. King, J. Zaveri, H. S. Yang, M. Bakir, J. D. Meindl, "Electro-Fluidic C4 Interconnections for Inter-Layer Liquid Cooling of 3D ICs," SRC TECHCON, Austin, TX, Sept. 2009.

[3] J. Zaveri, C. R. King, H. S. Yang, M. Bakir, "Wafer Level Batch Fabrication of Silicon Microchannel Heat Sinks and Electrical Through-Silicon Vias for 3D ICs," IMAPS 42nd International Symposium on Microelectronics, San Jose, CA Nov. 2009.

[4] H. S. Yang, M. Bakir, "Interconnect Technologies for 3D Integration of CMOS and MEMS,", MRS Spring Meeting 2010, San Francisco, CA, April 2010. (invited)

[5] H. S. Yang, M. Bakir, "Mechanically Flexible Interconnects with High Out-of-Plane Range-of-Movement and Thick Wafer Through Silicon Vias for CMOS and MEMS Integration," IEEE 60th Electronic Components and Technology Conference, Las Vegas, NV June 2010.

[6] R. Ravindran, J. A. Sadie, K. E. Scarberry, H. S. Yang, M. S. Bakir, J. F. McDonald, and J. D. Meindl, "Biochemical Sensing with an Arrayed Silicon Nanowire Platform," IEEE 60th Electronic Components and Technology Conference, Las Vegas, NV June 2010.

[7] H. S. Yang, M. Bakir, "A 3D Interconnect System for Large Biosensor Array and CMOS Signal-Processing IC Integration," IEEE International Interconnect Technology Conference, San Francisco, CA June 2010.

[8] H. S. Yang, M.Bakir, "TBA," TechCON 2010, Austin, TX, Sept 2010.

Presentations

[1] H. S. Yang, M. Bakir, "Marriage of CMOS and MEMS," SRC GRC Review, Atlanta, GA, June 2010

Posters

[1] H. S. Yang, H. Chen, J. H. Lai, J. D. Meindl, M. Bakir, "Marriage of CMOS and MEMS," SRC GRC Review, Atlanta, GA, June 2009.

[2] H. S. Yang, M. Bakir, "3D Interconnect System for Sensor/MEMS and CMOS IC Integration", Georgia Tech Research and Innovation Conference, Atlanta, GA, Feb 2010.

Media Coverage

[1] T. Adams, "A Cool Innovation Stacks Microprocessors", Chip Scale Review, Jan. 2009 Issue